Abstract: Conductive powder coating could be prepared by bonding base powder with graphene which migrates to top layer of coating surface during curing process. By comparison， graphene is also co-extruded with the coating composition. The results indicate that the same content of graphene 0.3％ can enable the surface resistance of the coating via extruding process to be 1012 Ω while the surface resistance of the coating via bonding process is 106 Ω， indicating that the bonding process can significantly reduce the amount of graphene used in the formulation， which significantly results in cost reduction. Chemical structure is studied by FT-IR and the curing process is monitored by DSC. In addition， the influence of graphene content on electrical resistance of the film is also studied.